DIP

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Under Construction

Dual in-line package, or DIP, is a chip package with two rows of pins. It can be through-hole mounted or inserted in a socket. Common packages can have anywhere from 4 to 64 pins.

Other names: DIL, PDIP, SDIP, SPDIP, CDIP, CERDIP

0.1" Pitch, 0.3" Wide

The most common style of DIP packages, with a pitch of 0.1" (2.54 mm) and a row spacing of 0.3".

Drawing Name # of Pins Author License Tested Download
Eagle gEDA KiCAD Protel ORCAD
DIP4 DIP4 4 No
DIP8 DIP8 8 SparkFun Electronics CC 3.0 Share-Alike No Link
DIP14 DIP14 14 SparkFun Electronics CC 3.0 Share-Alike No Link
DIP16 DIP16 16 SparkFun Electronics CC 3.0 Share-Alike No Link
DIP18 DIP18 18 SparkFun Electronics CC 3.0 Share-Alike No Link
DIP24 DIP24 24 SparkFun Electronics CC 3.0 Share-Alike No Link
DIP28 DIP28 28 gEDA Project GPL No Link

0.1" Pitch, 0.6" Wide

A pitch of 0.1" (2.54 mm) and a row spacing of 0.6".

Drawing Name # of Pins Author License Tested Download
Eagle gEDA KiCAD Protel ORCAD
DIP4 DIP4 4 No
DIP8 DIP8 8 No
DIP16 DIP16 16 No
DIP24 DIP24 24 No
DIP28 DIP28 28 No