SenseOpen/HwAnalysis/Senseo HD78XX

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Revision as of 10:16, 3 November 2011 by 77.5.86.101 (talk)
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Components overview

  • 24C02 EEPROM, serial I2C bus
  • 46R47 8bit A/D Type OTP MCU controller
  • boiler
  • vibration pump (high-flow micropump)
  • BT139 triac
  • interference suppression capacitor
  • Capacitors
  • Diodes
  • Resistors
  • LEDs
  • micro switches


Testpoints

  • TP1: between R1 and R5/, LP/LH
  • TP2: N
  • TP3:
  • TP4: between AMP4 and Q2, NP (pump)
  • TP5: GND, at D2
  • TP6: VDD, at D3 and C2
  • TP7: between C1/C11 and D1
  • TP8: liquid level mini PCB, between C7 and JX.1
  • TP9: liquid level mini PCB, between C7 and JX.2
  • TP10: liquid level mini PCB, between R19 and U3
  • TP11: between R4 and Q2
  • TP12: between R2 and TRIAC
  • TP13: between R14 and S2
  • TP14: between R15 and S1
  • TP15: between R16 and S3
  • TP16:
  • TP17: between R7 and R3/ uC Pin 15 / PA7
  • TP18: between R2 and uC Pin 18 / PA4/TMR
  • TP19: between R14 and uC Pin 2 / PA2
  • TP20: between R15 and uC Pin 3 / PA1
  • TP21: between R16 and uC Pin 4 / PA0
  • TP22:
  • TP23: between R13 and D4
  • TP24: EEPROM Pin 5 / SDA line
  • TP25: at uC Pin 5
  • TP26: between R20 and uC Pin 1 / PA3/PFD
  • TP27: EEPROM Pin 8 / WC line, uC Pin 10 / PD0/PWM
  • TP28:
  • TP29: between R9 and uC Pin 7
  • TP30:
  • TP31: between R8 and uC Pin 11 / RES
  • TP32: between R3 and uC Pin 16 / PA6

TP33: between R1 and TP34: between R4 and R20